Pressure sensing element and display device having the same

ABSTRACT

A display device includes a pressure sensing element. The pressure sensing element senses a pressure input applied thereto from the outside, and the display device is controlled based on the sensed pressure input. The pressure sensing element includes a contact sensing area to sense the pressure input and a defect sensing area to sense a defect. The pressure sensing element measures a resistance value in the defect sensing area and identifies whether at least one of lines of the pressure sensing element is disconnected.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/540,909, filed on Aug. 14, 2019, which claims priority to and thebenefit Korean Patent Application No. 10-2018-0152472, filed on Nov. 30,2018, in the Korean Intellectual Property Office (KIPO), the disclosuresof which are incorporated herein by reference in their entirety.

BACKGROUND 1. Field

The present disclosure relates to a pressure sensing element that sensesa pressure input applied thereto from an external source and a displaydevice including the pressure sensing element.

2. Description of the Related Art

In today's information society, the importance of a display device as amedium for presenting information in a visual form has been increasing.Currently, various types of display devices such as a liquid crystaldisplay (LCD), a plasma display panel (PDP), an organic light emittingdisplay (OLED), a field effect display (FED), and an electrophoreticdisplay (EPD) are used.

The display device is activated in response to an electrical signalapplied thereto. For example, a display device may include an inputsensing circuit that senses a touch event applied thereto from theoutside of the display device.

Physical buttons may be arranged at an outer portion of the displaydevice to receive a control signal from a user. The user may change alevel of sound output from the display device or turns on or off a powersource of the display device using at least one of the physical buttons.

SUMMARY

The present disclosure provides a pressure sensing element having astructure that is capable of accurately determining a presence of adefect therein.

The present disclosure provides a display device having the pressuresensing element.

Embodiments of the inventive concept provide a pressure sensing elementincluding a first base, a first transmitting electrode, a firstreceiving electrode, a first main pressure sensing layer, a firstsub-pressure sensing layer, and a second base.

The first transmitting electrode is disposed on the first base andincludes a first transmitting terminal and a plurality of firsttransmitting lines electrically connected to the first transmittingterminal.

The first receiving electrode is disposed on the first base and includesa first receiving terminal and a plurality of first receiving linesalternately arranged with the plurality of first transmitting lines andelectrically connected to the first receiving terminal.

The first main pressure sensing layer is disposed on the firsttransmitting electrode and the first receiving electrode and is spacedapart from the first transmitting electrode and the first receivingelectrode by a first set distance.

The first sub-pressure sensing layer is disposed on the firsttransmitting electrode and the first receiving electrode and makescontact with the first transmitting electrode and the first receivingelectrode without overlapping the first main pressure sensing layer whenviewed in a plan view.

The second base is disposed on the first main pressure sensing layer andthe first sub-pressure sensing layer, makes contact with the first mainpressure sensing layer, and is spaced apart from the first sub-pressuresensing layer by a second set distance.

The pressure sensing element may further include a sealing member thatcouples the first base and the second base.

A first area of the first main pressure sensing layer is greater than asecond area of the first sub-pressure sensing layer.

At least one of the first main pressure sensing layer and the firstsub-pressure sensing layer may include a polymer resin and metalparticles.

A first number of the plurality of first transmitting lines is equal toa second number of the plurality of first receiving lines.

The first main pressure sensing layer makes contact with at least aportion of the first transmitting electrode and the first receivingelectrode when a pressure input is applied from an outside sourcethrough the second base.

The first transmitting terminal and the first receiving terminal aredisposed adjacent to a first side portion of the first main pressuresensing layer when viewed in the plan view, and the first sub-pressuresensing layer is disposed adjacent to a second side portion of the firstmain pressure sensing layer when viewed in the plan view.

The pressure sensing element may further include a coating layer. Thecoating layer is disposed on the first receiving electrode and the firsttransmitting electrode, is disposed under the first main pressuresensing layer, overlaps portions of the plurality of first transmittinglines and the plurality of first receiving lines. The coating layer mayinclude a hydrophobic material. The hydrophobic material may include atleast one of fluorine (F) and silicon (Si).

The pressure sensing element further may include a second transmittingelectrode, a second receiving electrode, a second main pressure sensinglayer, and a second sub-pressure sensing layer.

The second transmitting electrode is disposed on the first base andincludes a second transmitting terminal and a plurality of secondtransmitting lines electrically connected to the second transmittingterminal.

The second receiving electrode is disposed on the first base andincludes a second receiving terminal and a plurality of second receivinglines alternately arranged with the plurality of second transmittinglines and electrically connected to the second receiving terminal.

The second main pressure sensing layer is disposed on the secondtransmitting electrode and the second receiving electrode and is spacedapart from the second transmitting electrode and the second receivingelectrode by the first set distance.

The second sub-pressure sensing layer is disposed on the secondtransmitting electrode and the second receiving electrode and makescontact with the second transmitting electrode and the second receivingelectrode without overlapping the second main pressure sensing layer.

The second transmitting terminal and the second receiving terminal aredisposed adjacent to the third side portion of the second main pressuresensing layer when viewed in the plan view, and the second sub-pressuresensing layer is disposed adjacent to a fourth side portion of thesecond main pressure sensing layer when viewed in the plan view.

The second main pressure sensing layer makes contact with the secondtransmitting electrode and the second receiving electrode when apressure input is applied from an outside source through the secondbase.

The pressure sensing element may further include a third transmittingelectrode, a third receiving electrode, and a third sub-pressure sensinglayer.

The third transmitting electrode may include a third transmittingterminal and a plurality of third transmitting lines electricallyconnected to the third transmitting terminal, is disposed on the firstbase, and is disposed between the first transmitting electrode and thesecond transmitting electrode when viewed in the plan view.

The third receiving electrode may include a third receiving terminal anda plurality of third receiving lines alternately arranged with theplurality of third transmitting lines and electrically connected to thethird receiving terminal, is disposed on the first base, and is disposedbetween the first receiving electrode and the second receiving electrodewhen viewed in the plan view.

The third sub-pressure sensing layer is disposed on the thirdtransmitting electrode and the third receiving electrode, makes contactwith the third transmitting electrode and the third receiving electrode,and is disposed between the first sub-pressure sensing layer and thesecond sub-pressure sensing layer when viewed in the plan view.

The second main pressure sensing layer is not disposed between the thirdtransmitting electrode and the second base, and between the thirdreceiving electrode and the second base.

The pressure sensing element may further include a plurality of spacersdisposed between at least one of adjacent pairs of the plurality offirst transmitting lines and the plurality of second transmitting linesand between at least one of adjacent pairs of the plurality of secondtransmitting lines and the plurality of third transmitting lines.

Embodiments of the inventive concept provide a display device includinga display panel including a plurality of light emitting elements, aninput sensing circuit including a plurality of sensors disposed on thedisplay panel and capacitively coupled to each other and an inputsensing driver electrically connected to the plurality of sensors, apressure sensing element disposed under the display panel, and a bracketdisposed under the pressure sensing element.

The pressure sensing element includes a first base, a transmittingelectrode, a receiving electrode, a main pressure sensing layer, asub-pressure sensing layer, and a second base.

The transmitting electrode is disposed on the first base and includes atransmitting terminal and a plurality of transmitting lines electricallyconnected to the transmitting terminal.

The receiving electrode is disposed on the first base and includes areceiving terminal and a plurality of receiving lines alternatelyarranged with the plurality of transmitting lines and electricallyconnected to the receiving terminal.

The main pressure sensing layer is disposed on the transmittingelectrode and the receiving electrode and is spaced apart from thetransmitting electrode and the receiving electrode by a first setdistance.

The sub-pressure sensing layer is disposed on the transmitting electrodeand the receiving electrode and makes contact with the transmittingelectrode and the receiving electrode without overlapping the mainpressure sensing layer when viewed in a plan view.

The second base is disposed on the main pressure sensing layer and thesub-pressure sensing layer, makes contact with the main pressure sensinglayer, and is spaced apart from the sub-pressure sensing layer by asecond set distance.

The transmitting terminal and the receiving terminal are electricallyconnected to the input sensing driver, and the input sensing drivermeasures a resistance value formed by the transmitting electrode, thereceiving electrode, the main pressure sensing layer, and thesub-pressure sensing layer.

At least one of the main pressure sensing layer and the sub-pressuresensing layer may include a polymer resin and metal particles.

The main pressure sensing layer makes contact with the transmittingelectrode and the receiving electrode when a pressure is applied from anoutside source through the second base.

The transmitting terminal and the receiving terminal may be disposedadjacent to a first side portion of the main pressure sensing layer whenviewed in the plan view, and the sub-pressure sensing layer is disposedadjacent to a second side portion of the main pressure sensing layerwhen viewed in the plan view.

According to the above, the pressure sensing element may have astructure to accurately determine an occurrence of a defect in which atleast one of the transmitting lines and the receiving lines isdisconnected.

In addition, the pressure sensing element may have strong durabilityeven in high-temperature and high-humidity environments.

Further, since physical buttons that may be typically arranged at anouter portion of the display device may be omitted and replaced with thepressure sensing element, aesthetic characteristics of the displaydevice are improved.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1 is a perspective view showing a display device according to anexemplary embodiment of the present disclosure;

FIG. 2 is a cross-sectional view showing a display device according toan exemplary embodiment of the present disclosure;

FIGS. 3A and 3B are cross-sectional views showing a display module shownin FIG. 2;

FIG. 4 is a plan view showing a display panel according to an exemplaryembodiment of the present disclosure;

FIG. 5 is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the present disclosure;

FIG. 6 is a waveform diagram showing a light emitting control signal andscan signals applied to the pixel shown in FIG. 5;

FIG. 7 is a cross-sectional view showing a portion of a pixel accordingto an exemplary embodiment of the present disclosure;

FIG. 8 is a plan view showing an input sensing circuit according to anexemplary embodiment of the present disclosure;

FIG. 9 is a cross-sectional view showing a portion of a pressure sensingelement according to an exemplary embodiment of the present disclosure;

FIG. 10 is a plan view showing a portion of a pressure sensing elementaccording to an exemplary embodiment of the present disclosure;

FIGS. 11A and 11B are plan views showing examples of a portion ofpressure sensing elements according to an exemplary embodiment of thepresent disclosure;

FIGS. 12 and 13A to 13C are plan views showing examples of a portion ofpressure sensing elements according to an exemplary embodiment of thepresent disclosure;

FIG. 14A is a cross-sectional view showing a portion of a pressuresensing element according to an exemplary embodiment of the presentdisclosure; and

FIG. 14B is a plan view showing a portion of a pressure sensing elementaccording to an exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

Hereinafter, the present disclosure will be explained in detail withreference to the accompanying drawings.

In the drawings, the thickness of layers, films, and regions areexaggerated for clarity. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

It will be further understood that the terms “includes” and its variantssuch as “including”, etc., when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

FIG. 1 is a perspective view showing a display device DD according to anexemplary embodiment of the present disclosure.

FIG. 1 shows a smartphone as an example of the display device DD,however, the display device DD should not be limited to the smartphone.That is, the display device DD may be a large-sized electronic devicesuch as a television set and a monitor, and a small and medium-sizedelectronic device such as a mobile phone, a tablet computer, anavigation device, a game device, and a smart watch.

The display device DD includes a display area DA through which an imageIM is displayed and a non-display area NDA disposed adjacent to thedisplay area DA.

The display area DA may be substantially parallel to a surface of thedisplay device DD that is defined by a first directional axis DR1 and asecond directional axis DR2. A third directional axis DR3 indicates anormal direction of the display area DA, i.e., a thickness direction ofthe display device DD. Front (or upper) and rear (or lower) surfaces ofthe display device DD are distinguished from each other by the thirddirectional axis DR3. However, directions indicated by the first,second, and third directional axes DR1, DR2, and DR3 may be relative toeach other and may be changed to other directions. Hereinafter, first,second, and third directions respectively correspond to directionsindicated by the first, second, and third directional axes DR1, DR2, andDR3 and are assigned with the same reference numerals as the first,second, and third directional axes DR1, DR2, and DR3.

A shape of the display area DA shown in FIG. 1 is merely exemplary, andthe shape of the display area DA may be changed in various shapes,sizes, and configurations without being limited to the exampleillustrated in FIG. 1 without deviating from the scope of the presentdisclosure.

The image IM may not be displayed in the non-display area NDA. Forexample, the non-display area NDA defines or encompasses at least aportion of a bezel area of the display device DD.

The non-display area NDA may surround the display area DA, however, itshould not be limited thereto or thereby. The display area DA and thenon-display area NDA may correspond to areas that are relative to eachother.

In the exemplary embodiment of the present disclosure, the display areaDA may include a pressure sensing area PSA. A user may apply a pressureto the pressure sensing area PSA to adjust a level of sound output fromthe display device DD. In another exemplary embodiment, the user mayapply a pressure to the pressure sensing area PSA to turn on or off apower source of the display device DD.

In the exemplary embodiment of the present disclosure, the pressuresensing area PSA may be disposed adjacent to an edge of the display areaDA, however, it should not be limited thereto or thereby. That is, aposition of the pressure sensing area PSA may be changed withoutdeviating from the scope of the present disclosure. For example, thepressure sensing area PSA may be disposed in the non-display area NDA oreven on a side or a rear surface of the display device DD. In addition,in the exemplary embodiment of the present disclosure, the pressuresensing area PSA may be provided in a plural number.

FIG. 2 is a cross-sectional view showing the display device DD accordingto an exemplary embodiment of the present disclosure. FIGS. 3A and 3Bare cross-sectional views showing a display module shown in FIG. 2. FIG.2 shows a cross-section defined by the second directional axis DR1 andthe third directional axis DR3.

The display device DD includes a display module DM, a plurality offunctional layers FC1 to FC3, a base film BF, a shock absorbing memberCSH, a heat discharging member RD, an electrostatic shielding memberESD, a pressure sensing element PS, a bracket BRK, and a plurality ofadhesive members AD1 to AD7.

In the exemplary embodiment of the present disclosure, each of theadhesive members AD1 to AD7 may be a pressure sensitive adhesive. Thepressure sensitive adhesive is a type of an adhesive that forms a bondwith an adherend when pressure is applied without requiring activationwith solvent, water, or heat.

The functional layers FC1 to FC3 are disposed on one side of the displaymodule DM. For example, the functional layers FC1 to FC3 are disposedabove the display module DM in FIG. 2.

A first functional layer FC1 is adhered to the display module DM by afirst adhesive member AD1. A second functional layer FC2 is adhered tothe first functional layer FC1 by a second adhesive member AD2. A thirdfunctional layer FC3 is adhered to the second functional layer FC2 by athird adhesive member AD3.

In the exemplary embodiment of the present disclosure, each of thefunctional layers FC1 to FC3 may include a polymer material or a glassmaterial. Each of the functional layers FC1 to FC3 may have a filmshape.

In the exemplary embodiment of the present disclosure, the firstfunctional layer FC1 may be a polarizing functional layer that polarizesa light incident thereto. The second functional layer FC2 may be a shockabsorbing functional layer that absorbs a shock applied thereto from theoutside. The third functional layer FC3 may be a window functional layerthat forms an exterior of the display device DD. According to anotherembodiment of the present disclosure, one or more layers of the first tothird functional layers FC1 to FC3 may be omitted.

The base film BF, the shock absorbing member CSH, the heat dischargingmember RD, the electrostatic shielding member ESD, and the pressuresensing element PS are disposed on another side of the display module DMthat is opposite to the side on which the functional layers FC1 to FC3are disposed. For example, the base film BF, the shock absorbing memberCSH, the heat discharging member RD, the electrostatic shielding memberESD, and the pressure sensing element are disposed under the displaymodule DM in FIG. 2.

The base film BF is disposed under the display module DM. The base filmBF is adhered to a lower side of the display module DM by a fourthadhesive member AD4.

The base film BF may include a polymer material. In the exemplaryembodiment of the present disclosure, the base film BF may have a blackcolor.

The shock absorbing member CSH is disposed under the base film BF. Theshock absorbing member CSH is adhered to a lower side of the base filmBF by a fifth adhesive member AD5.

The shock absorbing member CSH may include a polymer material. The shockabsorbing member CSH can absorb a shock applied thereto from theoutside.

In the exemplary embodiment of the present disclosure, the shockabsorbing member CSH may include a thermoplastic polyurethane or a foamrubber.

The heat discharging member RD is disposed under the shock absorbingmember CSH. The heat discharging member RD is adhered to a lower side ofthe shock absorbing member CSH by a sixth adhesive member AD6.

The heat discharging member RD can discharge heat generated from thedisplay module DM to the outside. In the exemplary embodiment of thepresent disclosure, the heat discharging member RD may include agraphite or stainless.

The electrostatic shielding member ESD is disposed under the heatdischarging member RD. The electrostatic shielding member ESD is adheredto a lower side of the heat discharging member RD by a seventh adhesivemember AD7.

The electrostatic shielding member ESD can prevent or reduce staticelectricity that may interfere with and affect the display module DM.The electrostatic shielding member ESD may include a metal material. Forexample, the electrostatic shielding member ESD may include copper (Cu),iron (Fe), or aluminum (Al).

The pressure sensing element PS is disposed under the electrostaticshielding member ESD. The position of the pressure sensing area PSA(refer to FIG. 1) is determined depending on a position of the pressuresensing element PS.

In the exemplary embodiment of the present disclosure, the pressuresensing element PS overlaps a portion adjacent to an edge of theelectrostatic shielding member ESD in the cross-sectional view, however,it should not be limited thereto or thereby. That is, the position ofthe pressure sensing element PS relative to the pressure sensing areaPSA and/or the electrostatic shielding member ESD may be changed withoutdeviating from the scope of the present disclosure.

In the exemplary embodiment of the present disclosure, at least one ofthe base film BF, the shock absorbing member CSH, the heat dischargingmember RD, the electrostatic shielding member ESD, and the fourth toseventh adhesive members AD4 to AD7 may be omitted without deviatingfrom the scope of the present disclosure.

The bracket BRK is disposed under the pressure sensing element PS. Thebracket BRK accommodates the display module DM, the base film BF, theshock absorbing member CSH, the heat discharging member RD, theelectrostatic shielding member ESD, and the pressure sensing element PS.

Referring to FIG. 3A, the display module DM includes a display panel DPand an input sensing circuit ISC disposed on the display panel DP. Theinput sensing circuit ISC can sense a touch input and/or a pressureinput applied thereto from the outside.

The input sensing circuit ISC may be directly disposed on a thin filmencapsulation layer (not shown) of the display panel DP. Here, theexpression “directly disposed” means that the input sensing circuit ISCis disposed on the display panel DP without an adhesive member.

Referring to FIG. 3B, a display module DM-1 includes the display panelDP, the input sensing circuit ISC, and an eighth adhesive member AD8.The display panel DP and the input sensing circuit ISC are adhered toeach other by the eighth adhesive member AD8.

FIG. 4 is a plan view showing the display panel DP according to anexemplary embodiment of the present disclosure.

The display panel DP includes a display area DP-DA and a non-displayarea DP-NDA when viewed in a plan view. In the present exemplaryembodiment, the non-display area DP-NDA is defined along an edge of thedisplay area DP-DA. The display area DP-DA and the non-display areaDP-NDA of the display panel DP may respectively correspond to thedisplay area DA and the non-display area NDA of the display device DDshown in FIG. 1.

The display panel DP includes a scan driver 100, a data driver 200, aplurality of scan lines SL, a plurality of light emitting control linesECL, a plurality of data lines DL, a plurality of power source lines PL,and a plurality of pixels PX. The pixels PX are arranged in the displayarea DP-DA. Each of the pixels PX includes an organic light emittingdiode OLED (refer to FIG. 5) and a pixel circuit CC (refer to FIG. 5)connected to the organic light emitting diode OLED.

The scan driver 100 includes a scan driving member and a light emittingcontrol driver.

The scan driving member generates scan signals and sequentially outputsthe generated scan signals to the scan lines SL. The light emittingcontrol driver generates light emitting control signals and outputs thegenerated light emitting control signals to the light emitting controllines ECL.

According to another embodiment of the present disclosure, the scandriving member and the light emitting control driver may be implementedin a single circuit in the scan driver 100 without being separated fromeach other.

The scan driver 100 may include a plurality of thin film transistorsformed through the same process as that used to form a driving circuitof the pixels PX, for example, a low temperature polycrystalline silicon(LTPS) process or a low temperature polycrystalline oxide (LTPO)process.

The data driver 200 outputs data signals to the data lines DL. The datasignals are analog voltages corresponding to grayscale values of imagedata.

In the exemplary embodiment of the present disclosure, the data driver200 may be mounted on a printed circuit board FPCB, and the printedcircuit board FPCB may be connected to pads arranged at one ends of thedata lines DL, however, it should not be limited thereto or thereby.That is, the data driver 200 may be integrally implemented or directlymounted on the display panel DP.

The scan lines SL extend in the second direction DR2 and are arranged inthe first direction DR1 crossing the second direction DR2. In theexemplary embodiment of the present disclosure, the second direction DR2and the first direction DR1 may be perpendicular to each other, however,the extending and arranging directions of the scan lines SL should notbe limited thereto or thereby.

The light emitting control lines ECL also extend in the second directionDR2 and are arranged in the first direction DR1. That is, each of thelight emitting control lines ECL may be arranged parallel to acorresponding scan line among the scan lines SL.

The data lines DL extend in the first direction DR1 and are arranged inthe second direction DR2 crossing the first direction DR1. The datalines DL transmit the data signals to corresponding pixels among thepixels PX.

The power source lines PL extend in the first direction DR1 and arearranged in the second direction DR2. The power source lines PL transmita first power source ELVDD to corresponding pixels among the pixels PX.

Each of the pixels PX is connected to a corresponding scan line amongthe scan lines SL, a corresponding light emitting control line among thelight emitting control lines ECL, a corresponding data line among thedata lines DL, and a corresponding power source line among the powersource lines PL.

The non-display area DP-NDA of the display panel DP includes a bendingarea BA. When the display panel DP is bent with respect to the bendingarea BA, a size of the non-display area DP-NDA decreases on a planesurface defined by the first direction DR1 and the second direction DR2,and thus the bezel of the display device DD becomes smaller. That is, asize of the non-display area NDA of the display device DD shown in FIG.1 decreases after the display panel DP is bent.

FIG. 5 is an equivalent circuit diagram showing the pixel PX accordingto an exemplary embodiment of the present disclosure. FIG. 6 is awaveform diagram showing the light emitting control signal Ei and thescan signals Si−1, S, and Si+1 applied to the pixel PX shown in FIG. 5.FIG. 5 shows the pixel PX connected to an i-th scan line SLi and an i-thlight emitting control line ECLi.

The pixel PX includes the organic light emitting diode OLED and thepixel circuit CC. The pixel circuit CC includes a plurality oftransistors T1 to T7 and a capacitor CP. The pixel circuit CC controlsan amount of current flowing through the organic light emitting diodeOLED in response to the data signal received from the data line DL.

The organic light emitting diode OLED emits a light with a predeterminedbrightness in response to the amount of current provided from the pixelcircuit CC. To this end, a level of the first power source ELVDD is sethigher than a level of a second power source ELVSS.

Each of the transistors T1 to T7 includes an input electrode (or sourceelectrode), an output electrode (or drain electrode), and a controlelectrode (or gate electrode). In the following description, for theconvenience of explanation, one electrode of the input electrode and theoutput electrode will be referred to as a “first electrode”, and theother electrode of the input electrode and the output electrode will bereferred to as a “second electrode”.

A first electrode of a first transistor T1 is connected to the firstpower source ELVDD via a fifth transistor T5, and a second electrode ofthe first transistor T1 is connected to an anode electrode of theorganic light emitting diode OLED via a sixth transistor T6. The firsttransistor T1 may be referred to as a “driving transistor”.

The first transistor T1 controls the amount of the current flowingthrough the organic light emitting diode OLED in response to a voltageapplied to a control electrode thereof. A second transistor T2 isconnected between the data line DL and the first electrode of the firsttransistor T1. A control electrode of the second transistor T2 isconnected to the i-th scan line SLi. When an i-th scan signal Si isapplied to the i-th scan line SLi, the second transistor T2 is turned onto electrically connect the data line DL and the first electrode of thefirst transistor T1.

A third transistor T3 is connected between the second electrode and thecontrol electrode of the first transistor T1. A control electrode of thethird transistor T3 is connected to the i-th scan line SLi. When thei-th scan signal Si is applied to the i-th scan line SLi, the thirdtransistor T3 is turned on to electrically connect the second electrodeand the control electrode of the first transistor T1. Accordingly, whenthe third transistor T3 is turned on, the first transistor T1 may beconnected in a diode configuration.

A fourth transistor T4 is connected between a node ND and aninitialization power source generator (not shown). A control electrodeof the fourth transistor T4 is connected to an (i−1)th scan line SLi−1.When an (i−1)th scan signal Si−1 is applied to the (i−1)th scan lineSLi−1, the fourth transistor T4 is turned on to apply an initializationvoltage Vint to the node ND.

The fifth transistor T5 is connected between the power source line PLand the first electrode of the first transistor T1. A control electrodeof the fifth transistor T5 is connected to the i-th light emittingcontrol line ECLi.

The sixth transistor T6 is connected between the second electrode of thefirst transistor T1 and the anode electrode of the organic lightemitting diode OLED. A control electrode of the sixth transistor T6 isconnected to the i-th light emitting control line ECLi.

A seventh transistor T7 is connected between the initialization powersource generator (not shown) and the anode electrode of the organiclight emitting diode OLED. A control electrode of the seventh transistorT7 is connected to an (i+1)th scan line SLi+1. When an (i+1)th scansignal Si+1 is applied to the (i+1)th scan line SLi+1, the seventhtransistor T7 is turned on to apply the initialization voltage Vint tothe anode electrode of the organic light emitting diode OLED.

The seventh transistor T7 may improve a black expression ability of thepixel PX. In detail, when the seventh transistor T7 is turned on, aparasitic capacitance (not shown) of the organic light emitting diodeOLED is discharged. In the absence of the seventh transistor T7, aleakage current flowing through the first transistor T1 may cause theorganic light emitting diode OLED to emit light due to the parasiticcapacitance when the data signal received at the pixel PX indicates thepixel PX to express a black color. Then, when implementing a blackluminance, the organic light emitting diode OLED does not emit the lightdue to the discharge of the parasitic capacitance by the seventhtransistor T7 even if there is a leakage current flowing the firsttransistor T1, and thus the black expression ability may be improved.

Additionally, in FIG. 5, the control electrode of the seventh transistorT7 is connected to the (i+1)th scan line SLi+1, however, the presentdisclosure should not be limited thereto or thereby. According toanother embodiment of the present disclosure, the control electrode ofthe seventh transistor T7 may be connected to the i-th scan line SLi orthe (i−1)th scan line SLi−1.

FIG. 5 shows p-type metal-oxide semiconductor (PMOS) transistors as anexample of the transistors T1-T7 included in the pixel PX, however, thepixel PX should not be limited to the PMOS. According to anotherembodiment of the present disclosure, the pixel PX may be implemented byn-type metal-oxide semiconductor (NMOS) transistors. According toanother embodiment of the present disclosure, the pixel PX may beimplemented by a combination of NMOS and PMOS transistors.

The capacitor CP is connected between the power source line PL and thenode ND. The capacitor CP is charged with a voltage corresponding to thedata signal on the data line DL. When the fifth transistor T5 and thesixth transistor T6 are turned on by the voltage charged in thecapacitor CP, the amount of the current flowing through the firsttransistor T1 is determined by the data signal.

In the present disclosure, the structure of the pixel PX should not belimited to the exemplary structure shown in FIG. 5. According to anotherembodiment of the present disclosure, the pixel PX may be implemented invarious ways to allow the organic light emitting diode OLED to emit thelight without deviating from the scope of the present disclosure.

Referring to FIG. 6, the light emitting control signal Ei may have ahigh level E-HIGH or a low level E-LOW. Each of the scan signals SLi−1,SLi, and SLi+1 has a high level S-HIGH or a low level S-LOW.

When the light emitting control signal Ei has the high level E-HIGH, thefifth transistor T5 and the sixth transistor T6 are turned off. When thefifth transistor T5 is turned off, the power source line PL and thefirst electrode of the first transistor T1 are electrically disconnectedfrom each other. When the sixth transistor T6 is turned off, the secondelectrode of the first transistor T1 and the anode electrode of theorganic light emitting diode OLED are electrically disconnected fromeach other. Accordingly, the organic light emitting diode OLED does notemit the light during a non-emission period in which the light emittingcontrol signal Ei at the high level E-HIGH is applied to the i-th lightemitting control line ECLi. During the non-emission period of the lightemitting control signal Ei, the scan signals Si−1, Si, and Si+1 areapplied in a sequential order.

Then, when the (i−1)th scan signal Si−1 applied to the (i−1)th scan lineSLi−1 has the low level S-LOW, the fourth transistor T4 is turned on.When the fourth transistor T4 is turned on, the initialization voltageVint is applied to the node ND.

When the i-th scan signal Si applied to the i-th scan line SLi has thelow level S-LOW, the second transistor T2 and the third transistor T3are turned on.

When the second transistor T2 is turned on, the data signal is appliedto the first electrode of the first transistor T1. In this case, sincethe node ND is initialized to the initialization voltage Vint, the firsttransistor T1 is turned on. When the first transistor T1 is turned on, avoltage corresponding to the data signal is applied to the node ND.Then, the capacitor CP is charged with the voltage corresponding to thedata signal.

When the (i+1)th scan signal Si+1 applied to the (i+1)th scan line SLi+1has the low level S-LOW, the seventh transistor T7 is turned on.

When the seventh transistor T7 is turned on, the initialization voltageVint is applied to the anode electrode of the organic light emittingdiode OLED, and thus the parasitic capacitor of the organic lightemitting diode OLED is discharged.

Following the non-emission period, when the light emitting controlsignal Ei having the low level E-LOW is applied to the light emittingcontrol line ECLi during an emission period, the fifth transistor T5 andthe sixth transistor T6 are turned on. When the fifth transistor T5 isturned on, the first power source ELVDD is applied to the firstelectrode of the first transistor T1. When the sixth transistor T6 isturned on, the second electrode of the first transistor T1 and the anodeelectrode of the organic light emitting diode OLED are electricallyconnected to each other. Then, the organic light emitting diode OLEDemits the light with the predetermined brightness in response to theamount of the current provided thereto.

FIG. 7 is a cross-sectional view showing a portion of the pixel PX(refer to FIG. 5) according to an exemplary embodiment of the presentdisclosure. FIG. 7 shows the first transistor T1 and the secondtransistor T2 as a representative example, however, the structure of thefirst transistor T1 and the second transistor T2 should not be limitedthereto or thereby. In FIG. 7, the second electrode ED2 of the firsttransistor T1 and the anode electrode AE of the organic light emittingdiode OLED are shown to be directly connected to each other, but itshould not be limited thereto or thereby. In the exemplary embodimentshown in FIG. 5, the first transistor T1 is connected to the anodeelectrode AE of the pixel PX via the sixth transistor T6. That is,according to some embodiments of the present disclosure, the secondelectrode ED2 of the first transistor T1 may directly make contact withthe anode electrode AE of the pixel PX or the second electrode ED2 ofthe first transistor T1 may be connected to the anode electrode AE viathe sixth transistor T6.

The display panel DP (refer to FIG. 4) includes a base member BL, acircuit layer CL, a light emitting device layer ELL, and anencapsulation layer TFE.

The circuit layer CL includes a buffer layer BFL, gate insulating layersGI1 and GI2, an interlayer insulating layer ILD, a circuit insulatinglayer VIA, and the first and second transistors T1 and T2.

The light emitting device layer ELL may include the organic lightemitting diode OLED and a pixel definition layer PDL.

The encapsulation layer TFE encapsulates the light emitting device layerELL to protect the light emitting device layer ELL from external oxygenor moisture.

The buffer layer BFL is disposed on one surface of the base member BL.

The buffer layer BFL prevents foreign substances in the base member BLfrom entering the pixel PX during a manufacturing process. Inparticular, the buffer layer BFL prevents the foreign substances fromentering active portions ACL of the first and second transistors T1 andT2 of the pixel PX.

The foreign substances may inflow from the outside or may be generatedwhen the base member BL is pyrolyzed. The foreign substances may be gasor sodium discharged from the base member BL. In addition, the bufferlayer BFL can block moisture from entering the pixel PX from theoutside.

The active portions ACL of the first and second transistors T1 and T2are disposed on the buffer layer BFL. Each of the active portions ACLincludes polysilicon or amorphous silicon. In another embodiment, theactive portions ACL may include a metal oxide semiconductor.

The active portions ACL include first and second ion doping areas and achannel area that disposed between the first and second ion dopingareas. The channel area serves as a passage through which electrons orholes move between the first and second ion doping areas.

A first gate insulating layer GI1 is disposed above the buffer layer BFLto cover the active portions ACL. The first gate insulating layer GI1may include an organic layer and/or an inorganic layer. The first gateinsulating layer GI1 may include a plurality of inorganic thin filmlayers. Examples of the inorganic thin film layers include, but are notlimited to, a silicon nitride layer and a silicon oxide layer.

The control electrodes GE1 of the first and second transistors T1 and T2are disposed on the first gate insulating layer GI1. The controlelectrode GE1 of the first transistor T1 may be one of two electrodesforming the capacitor CP. At least some portions of the scan lines SL(refer to FIG. 4) and the light emitting control lines ECL (refer toFIG. 4) are disposed on the first gate insulating layer GI1.

A second gate insulating layer GI2 is disposed on the first gateinsulating layer GI1 to cover the control electrodes GE1. The secondgate insulating layer GI2 may include an organic layer and/or aninorganic layer. The second gate insulating layer GI2 may include aplurality of inorganic thin film layers. Examples of the inorganic thinfilm layers include, but are not limited to, a silicon nitride layer anda silicon oxide layer.

The other electrode of the two electrodes forming the capacitor CP(refer to FIG. 5) is referred to as an electrode GE2, and the electrodeGE2 is disposed on the second gate insulating layer GI2. That is, thecontrol electrode GE1 disposed on the first gate insulating layer GI1overlaps the electrode GE2 disposed on the second gate insulating layerGI2 to form the capacitor CP shown in FIG. 5. However, positions of theelectrodes forming the capacitor CP should not be limited thereto orthereby.

The interlayer insulating layer ILD is disposed on the second gateinsulating layer GI2 to cover the electrode GE2. The interlayerinsulating layer ILD may include an organic layer and/or an inorganiclayer. The interlayer insulating layer ILD may include a plurality ofinorganic thin film layers. Examples of the inorganic thin film layersinclude, but are not limited to, a silicon nitride layer and a siliconoxide layer.

At least some portions of the data line DL (refer to FIG. 4) and thepower line PL (refer to FIG. 4) may be disposed on the interlayerinsulating layer ILD. The first electrodes ED1 and the second electrodesED2 of the first and second transistors T1 and T2 may be disposed on theinterlayer insulating layer ILD.

The first electrodes ED1 and the second electrodes ED2 are connected tothe corresponding active portions ACL through respective thru-holesdefined through the gate insulating layers GI1 and GI2 and theinterlayer insulating layer ILD.

The circuit insulating layer VIA is disposed on the interlayerinsulating layer ILD to cover the first electrodes ED1 and the secondelectrodes ED2 of the first and second transistors T1 and T2. Thecircuit insulating layer VIA may include an organic layer and/or aninorganic layer. The circuit insulating layer VIA provides a flatsurface.

The pixel definition layer PDL and the organic light emitting diode OLEDare disposed on the circuit insulating layer VIA.

The organic light emitting diode OLED may include the anode electrodeAE, a hole control layer HL, a light emitting layer EML, an electroncontrol layer EL, and a cathode electrode CE.

FIG. 8 is a plan view showing the input sensing circuit ISC according toan exemplary embodiment of the present disclosure.

The input sensing circuit ISC may include an input sensing area SAdefined therein to sense the external input.

The input sensing circuit ISC may include first sensor groups IEG1,second sensor groups IEG2, first signal lines SSL1, second signal linesSSL2, signal pads PD-S1 and PD-S2, a printed circuit board FPCB-T, andan input sensing driver 300.

Each of the first sensor groups IEG1 may extend in the second directionDR2, and the first sensor groups IEG1 may be arranged in the firstdirection DR1. Each of the first sensor groups IEG1 may include aplurality of first sensor patterns (hereinafter, also refer to as a“first sensor”) IE1. As an example, the first sensor IE1 may be areceiving (Rx) sensor.

Each of the second sensor groups IEG2 may extend in the first directionDR1, and the second sensor groups IEG2 may be arranged in the seconddirection DR2. Each of the second sensor groups IEG2 may include aplurality of second sensor patterns (hereinafter, also referred to as a“second sensor”) IE2. As an example, the second sensor IE2 may be atransmitting (Tx) sensor.

In the exemplary embodiment of the present disclosure, a length obtainedby measuring the first sensor group IEG1 in the second direction DR2 maybe shorter than a length obtained by measuring the second sensor groupIEG2 in the first direction DR1, however, it should not be limitedthereto or thereby.

In the exemplary embodiment of the present disclosure, each of the firstsensors IE1 may be capacitively coupled to the second sensors IE2adjacent thereto among the second sensors IE2 to form a capacitor. Inthe exemplary embodiment of the present disclosure, each of the firstsensors IE1 and the second sensors IE2 may form a capacitor with anearby external object (e.g., a person's finger.

In the exemplary embodiment of the present disclosure, the input sensingcircuit ISC may sense a variation in capacitance formed between thefirst sensors IE1 and the second sensors IE2 to determine whether anexternal input is applied thereto. In the exemplary embodiment of thepresent disclosure, the input sensing circuit ISC may sense a variationin capacitance formed between the first sensors IE1 and the externalobject and/or between the second sensors IE2 and the external object todetermine whether the external input is applied thereto.

The first signal lines SSL1 may be electrically connected to the firstsensor groups IEG1, respectively. In the exemplary embodiment of thepresent disclosure, the first signal lines SSL1 may be connected to thefirst sensor groups IEG1 in a single routing structure at one end of thefirst sensor groups IEG1 (e.g., the left end as shown in FIG. 8),however, it should not be limited thereto or thereby. For example, twofirst signal lines SSL1 may be connected to the first sensor groups IEG1in a dual routing structure at both ends of the first sensor groupsIEG1.

The second signal lines SSL2 may be electrically connected to the secondsensor groups IEG2, respectively. In the exemplary embodiment of thepresent disclosure, the second signal lines SSL2 may be connected to thesecond sensor groups IEG2 in a double routing structure (e.g., both topand bottom ends of the second sensor groups IEG2 as shown in FIG. 8),however, they should not be limited thereto or thereby. According toanother embodiment of the present disclosure, the second signal linesSSL2 may be connected to the second sensor groups IEG2 in a singlerouting structure (e.g., either one of the top or bottom ends of thesecond sensor groups IEG2).

The first signal pads PD-S1 may be connected to at least one of thefirst signal lines SSL1. The second signal pads PD-S2 may be connectedto at least one of the second signal lines SSL2.

The printed circuit board FPCB-T may be electrically connected to thesignal pads PD-S1 and PD-S2.

The input sensing driver 300 may be mounted on the printed circuit boardFPCB-T. The input sensing driver 300 may transmit, receive, or calculateelectrical signals to determine whether the user's touch occurs in theinput sensing area SA and whether a pressure input is applied to theinput sensing area SA.

FIG. 9 is a cross-sectional view showing a portion of the pressuresensing element PS shown in FIG. 2 according to an exemplary embodimentof the present disclosure. FIG. 10 is a plan view showing a portion ofthe pressure sensing element PS according to an exemplary embodiment ofthe present disclosure.

Referring to FIGS. 9 and 10, the pressure sensing element PS includes afirst base SB1, a second base SB2, a transmitting electrode ETT, areceiving electrode ETR, a main pressure sensing layer PLM, asub-pressure sensing layer PLS, and a sealing member SP. For theconvenience of explanation, the first and second bases SB1 and SB2 arenot shown in FIG. 10.

The first base SB1 may be a film including a polymer resin, for example,polyimide. The first base SB1 may have an insulating property.

The transmitting electrode ETT and the receiving electrode ETR may bedisposed on the first base SB1.

The transmitting electrode ETT may include a transmitting terminal TMT,a transmitting bus BBT, and a plurality of transmitting lines TL. Eachof the transmitting terminal TMT, the transmitting bus BBT, and thetransmitting lines TL may have substantially the same thickness. Each ofthe transmitting terminal TMT, the transmitting bus BBT, and thetransmitting lines TL may include a conductive material.

The receiving electrode ETR may include a receiving terminal TMR, areceiving bus BBR, and a plurality of receiving lines RL. Each of thereceiving terminal TMR, the receiving bus BBR, and the receiving linesRL may have substantially the same thickness. Each of the receivingterminal TMR, the receiving bus BBR, and the receiving lines RL mayinclude a conductive material. In one embodiment, the transmittingelectrode ETT and the receiving electrode ETR may include the sameconductive material. In another embodiment, the transmitting electrodeETT and the receiving electrode ETR may include different conductivematerials.

In the exemplary embodiment of the present disclosure, the transmittingterminal TMT and the receiving terminal TMR may be electricallyconnected to the input sensing driver 300 (refer to FIG. 8).

The transmitting bus BBT may be a wiring that electrically connects thetransmitting terminal TMT and the transmitting lines TL. In FIG. 10, thetransmitting bus BBT extends in the second direction DR2, however, itshould not be limited thereto or thereby.

The receiving bus BBR may be a wiring that electrically connects thereceiving terminal TMR and the receiving lines RL. In FIG. 10, thereceiving bus BBR extends in the second direction DR2, however, itshould not be limited thereto or thereby.

The transmitting lines TL extend from the transmitting bus BBT, and thereceiving lines RL extend from the receiving bus BBR.

Each of the transmitting lines TL and the receiving lines RL may extendin the first direction DR1.

On the plane surface defined by the first direction DR1 and the seconddirection DR2, the transmitting terminal TMT and the receiving terminalTMR may be disposed adjacent to one side portion of the main pressuresensing layer PLM, and the sub-pressure sensing layer PLS may bedisposed adjacent to the other side portion of the main pressure sensinglayer PLM.

The main pressure sensing layer PLM and the sub-pressure sensing layerPLS may be disposed on the transmitting electrode ETT and the receivingelectrode ETR. The main pressure sensing layer PLM and the sub-pressuresensing layer PLS do not overlap each other in the third direction DR3as shown in FIG. 9.

The main pressure sensing layer PLM may have an area greater than thatof the sub-pressure sensing layer PLS.

Referring to FIG. 9, the main pressure sensing layer PLM may be spacedapart from the transmitting electrode ETT and the receiving electrodeETR by a set distance in the third direction DR3. The main pressuresensing layer PLM may make contact with the second base SB2 on a sideopposite from the transmitting electrode ETT and the receiving electrodeETR.

The sub-pressure sensing layer PLS may make contact with thetransmitting electrode ETT and the receiving electrode ETR. Thesub-pressure sensing layer PLS may be spaced apart from the second baseSB2 by a set distance on a side opposite from the transmitting electrodeETT and the receiving electrode ETR in the third direction DR3.

The main pressure sensing layer PLM and the sub-pressure sensing layerPLS may include a conductive material. For example, at least one of themain pressure sensing layer PLM and the sub-pressure sensing layer PLSmay include a polymer resin and metal particles. In the exemplaryembodiment of the present disclosure, each of the metal particles may bedispersed in the polymer resin and may have a size in the order ofnanometers.

At least one of the main pressure sensing layer PLM and the sub-pressuresensing layer PLS may have a conductivity due to a tunneling effect thatoccurs between the metal particles when a pressure input is appliedthereto from the outside.

In the exemplary embodiment of the present disclosure, at least one ofthe main pressure sensing layer PLM and the sub-pressure sensing layerPLS may include a pressure conductive rubber.

In the exemplary embodiment of the present disclosure, at least one ofthe main pressure sensing layer PLM and the sub-pressure sensing layerPLS may include a quantum tunneling composite (QTC).

In the exemplary embodiment of the present disclosure, the sub-pressuresensing layer PLS may exhibit the conductivity property at all timesregardless of the pressure applied thereto from the outside.

The second base SB2 may be disposed on the main pressure sensing layerPLM and the sub-pressure sensing layer PLS. The second base SB2 may makecontact with the main pressure sensing layer PLM and may be spaced apartfrom the sub-pressure sensing layer PLS by a set distance as shown inFIG. 9.

The second base SB2 may be a film including a polymer resin, forexample, polyimide. The second base SB2 may have an insulating property.

The sealing member SP may couple the first base SB1 and the second baseSB2. In the exemplary embodiment of the present disclosure, the sealingmember SP may be an adhesive member, for example, a pressure sensitiveadhesive.

When the pressure is applied from the outside through the second baseBS2, the main pressure sensing layer PLM may make contact with at leasta portion of the transmitting electrode ETT and the receiving electrodeETR. Accordingly, a resistance value between the transmitting terminalTMT and the receiving terminal TMR (hereinafter, referred to as a“measured resistance value”) formed by the transmitting electrode ETT,the receiving electrode ETR, the main pressure sensing layer PLM, andthe sub-pressure sensing layer PLS varies. The input sensing driver 300(refer to FIG. 8) may sense a variation in the measured resistance valueand may determine whether the pressure is applied to the display deviceDD (refer to FIG. 1).

Even when no pressure is applied from the outside, the transmittingelectrode ETT and the receiving electrode ETR are still electricallyconnected to each other by the sub-pressure sensing layer PLS.Therefore, the input sensing driver 300 (refer to FIG. 8) may sense aresistance value between the transmitting terminal TMT and the receivingterminal TMR (hereinafter, referred to as an “initial resistance value”)formed by the transmitting electrode ETT, the receiving electrode ETR,and the sub-pressure sensing layer PLS.

The input sensing driver 300 (refer to FIG. 8) may sense the initialresistance value and may determine whether a disconnection occurs in thetransmitting electrode ETT and the receiving electrode ETR. In detail,when the initial resistance value is measured to be within a set range,the input sensing driver 300 (refer to FIG. 8) may determine that nodisconnection has occurred in an electrical path between thetransmitting electrode ETT and the receiving electrode ETR, and when theinitial resistance value is measured at infinity or above a set value,the input sensing driver 300 may determine that the disconnection hasoccurred in the electrical path between the transmitting electrode ETTand the receiving electrode ETR.

The initial resistance value may vary without deviating from the scopeof the present disclosure. For example, the initial resistance value mayvary based on a variance in at least one of (1) a length of linesdisposed at outermost positions among the transmitting lines TL and thereceiving lines RL, (2) a thickness of lines disposed at outermostpositions among the transmitting lines TL and the receiving lines RL,and (3) a length LL of the sub-pressure sensing layer PLS. However, itis understood that the initial resistance value may vary based on othervariables without deviating from the scope of the present disclosure.

In the exemplary embodiment of the present disclosure, the number of thetransmitting lines TL may be equal to the number of the receiving linesRL. Since the measured resistance value is determined by transmitting anelectrical signal from the input sensing driver 300 (refer to FIG. 8) tothe receiving lines RL through the transmitting lines TL and the mainpressure sensing layer PLM, the electrical signal may be stable when thenumber of the transmitting lines TL is equal to the number of thereceiving lines RL.

The pressure sensing area PSA may include a contact sensing area CSA anda defect sensing area BSA. The contact sensing area CSA may correspondto an area in which the main pressure sensing layer PLM is disposed, andthe defect sensing area BSA may correspond to an area in which thesub-pressure sensing layer PLS is disposed.

As a distance from the defect sensing area BSA to the transmittingterminal TMT and the receiving terminal TMR increases, the pressuresensing area PSA increases, and the input sensing driver 300 (refer toFIG. 8) may sense defects (or disconnection) in larger areas.

FIGS. 11A and 11B are plan views showing examples of a portion ofpressure sensing elements PS-1 and PS-2 according to an exemplaryembodiment of the present disclosure. Referring to FIG. 11A, atransmitting electrode ETT-1 of the pressure sensing element PS-1 mayinclude a transmitting terminal TMT, a transmitting bus BBT, and aplurality of transmitting lines TL-1. Among the transmitting lines TL-1,lines disposed at outermost positions have a twisted shape that isdifferent from the lines disposed at the outermost positions among thetransmitting lines TL shown in FIG. 10.

A receiving electrode ETR-1 of the pressure sensing element PS-1 mayinclude a receiving terminal TMR, a receiving bus BBR, and a pluralityof receiving lines RL-1. Among the receiving lines RL-1, lines disposedat the outermost positions have a twisted shape that is different fromthe lines disposed at the outermost positions among the receiving linesRL shown in FIG. 10.

A shape and a position of a sub-pressure sensing layer PLS-1 of thepressure sensing element PS-1 shown in FIG. 11A may be different fromthose of the sub-pressure sensing layer PLS of the pressure sensingelement PS shown in FIG. 10 due to a variation in the shape of thetransmitting lines TL-1 and the receiving lines RL-1.

Accordingly, an initial resistance value of the pressure sensing elementPS-1 shown in FIG. 11A may be greater than the initial resistance valueof the pressure sensing element PS shown in FIG. 10 due to the increasedlengths of the transmitting lines TL-1 and the receiving lines RL-1.

Description on the other components of the pressure sensing element PS-1is substantially the same as those described with reference to FIGS. 9and 10, and thus details thereof will be omitted.

Referring to FIG. 11B, a transmitting electrode ETT-2 of the pressuresensing element PS-2 may include a transmitting terminal TMT, atransmitting bus BBT, and a plurality of transmitting lines TL-2. Amongthe transmitting lines TL-2, lines disposed at outermost positions havea shape more twisted than the lines disposed at the outermost positionsamong the transmitting lines TL and TL-1 respectively shown in FIGS. 10and 11A.

A receiving electrode ETR-2 of the pressure sensing element PS-2 mayinclude a receiving terminal TMR, a receiving bus BBR, and a pluralityof receiving lines RL-2. Among the receiving lines RL-2, lines disposedat the outermost positions have a twisted shape different from the linesdisposed at the outermost positions among the receiving lines RL andRL-1 shown in FIGS. 10 and 11A.

A shape and a position of a sub-pressure sensing layer PLS-2 of thepressure sensing element PS-2 may be different from those of thesub-pressure sensing layers PLS and PLS-1 of the pressure sensingelements PS and PS-1 respectively shown in FIGS. 10 and 11A due to avariation in the shape of the transmitting lines TL-2 and the receivinglines RL-2.

Accordingly, an initial resistance value of the pressure sensing elementPS-2 shown in FIG. 11B may be greater than the initial resistance valueof the pressure sensing element PS shown in FIG. 10 and the initialresistance value of the pressure sensing element PS-1 shown in FIG. 11Adue to the increased lengths of the transmitting lines TL-1 and/or thereceiving lines RL-1.

Description on the other components of the pressure sensing element PS-2is substantially the same as those of the pressure sensing element PSdescribed with reference to FIGS. 9 and 10, and thus details thereofwill be omitted.

FIGS. 12 and 13A to 13C are plan views showing examples of a portion ofpressure sensing elements PS-3, PS-4, PS-5, and PS-6 according to anexemplary embodiment of the present disclosure.

Referring to FIG. 12, a pressure sensing area PSA-1 may include a firstpressure sensing area PSA1, a second pressure sensing area PSA2, and athird pressure sensing area PSA3 (hereinafter, also referred to as areference area). For the convenience of explanation, the bases SB1 andSB2 and the sealing member SP are not shown in FIG. 12.

A first transmitting electrode ETT1, a first receiving electrode ETR1, afirst main pressure sensing layer PLM1, and a first sub-pressure sensinglayer PLS1 may be disposed in the first pressure sensing area PSA1.

The first transmitting electrode ETT1 may include a first transmittingterminal TMT1, a first transmitting bus BBT1, and a plurality of firsttransmitting lines TL1.

The first receiving electrode ETR1 may include a first receivingterminal TMR1, a first receiving bus BBR1, and a plurality of firstreceiving lines RL1.

Description on the components disposed in the first pressure sensingarea PSA1 is substantially the same as those of the components disposedin the pressure sensing area PSA shown in FIGS. 9 and 10.

A second transmitting electrode ETT2, a second receiving electrode ETR2,a second main pressure sensing layer PLM2, and a second sub-pressuresensing layer PLS2 may be disposed in the second pressure sensing areaPSA2.

The second transmitting electrode ETT2 may include a second transmittingterminal TMT2, a second transmitting bus BBT2, and a plurality of secondtransmitting lines TL2.

The second receiving electrode ETR2 may include a second receivingterminal TMR2, a second receiving bus BBR2, and a plurality of secondreceiving lines RL2.

Description on the components disposed in the second pressure sensingarea PSA2 is substantially the same as those of the components disposedin the pressure sensing area PSA shown in FIGS. 9 and 10.

The third pressure sensing area PSA3 (or the reference area) may bedisposed between the first pressure sensing area PSA1 and the secondpressure sensing area PSA2.

A third transmitting electrode ETT3, a third receiving electrode ETR3,and a third sub-pressure sensing layer PLS3 may be disposed in the thirdpressure sensing area PSA3 (or the reference area). That is, differentfrom the first pressure sensing area PSA1 and the second pressuresensing area PSA2, a main pressure sensing layer is not disposed in thethird pressure sensing area PSA3 (or the reference area).

The third sub-pressure sensing layer PLS3 may be disposed between thefirst sub-pressure sensing layer PLS1 and the second sub-pressuresensing layer PLS2 in the first direction DR1.

The third transmitting electrode ETT3 may include a third transmittingterminal TMT3, a third transmitting bus BBT3, and a plurality of thirdtransmitting lines TL3.

The third receiving electrode ETR3 may include a third receivingterminal TMR3, a third receiving bus BBR3, and a plurality of thirdreceiving lines RL3.

Description on the components disposed in the third pressure sensingarea PSA3 (or the reference area) is substantially the same as those ofthe components (except for the main pressure sensing layer) disposed inthe pressure sensing area PSA shown in FIGS. 9 and 10.

The resistance value measured in the pressure sensing area PSA-1 by theinput sensing driver 300 may vary depending on a variation inenvironmental and/or operating conditions such as temperature andhumidity in addition to a pressure input provided from the outside. Thepressure sensing element PS-3 can distinguish whether the variation inresistance value measured by the input sensing driver 300 is due to thepressure input or the environmental and/or operating conditions (e.g.,temperature, humidity) and accurately determine whether the pressureinput is applied.

Different from the first pressure sensing area PSA1 and the secondpressure sensing area PSA2, the main pressure sensing layer is notdisposed in the third pressure sensing area PSA3 (or the referencearea). Thus, the resistance value measured by the third transmittingterminal TMT3 and the third receiving terminal TMR3 may not vary eventhough the pressure input is applied from the outside. That is, theresistance value measured by the third transmitting terminal TMT3 andthe third receiving terminal TMR3 may indicate the variance of theresistance value caused only by the environmental and/or operatingconditions (e.g., temperature, humidity).

That is, the pressure sensing element PS-3 can accurately determinewhether the pressure input is applied by comparing the resistance valuemeasured by the first transmitting terminal TMT1 and the first receivingterminal TMR1 with the resistance value measured by the thirdtransmitting terminal TMT3 and the third receiving terminal TMR3 or bycomparing the resistance value measured by the second transmittingterminal TMT2 and the second receiving terminal TMR2 with the resistancevalue measured by the third transmitting terminal TMT3 and the thirdreceiving terminal TMR3. For example, the amount of the variance in themeasured resistance value caused by the pressure input can be accuratelymeasured by subtracting the variance of the resistance value that ismeasured in the third pressure sensing area PSA3 from each of themeasured resistance values in the first pressure sensing area PSA1 andthe second pressure sensing area PSA2.

Referring to FIG. 13A, a pressure sensing element PS-4 according to anexemplary embodiment of the present disclosure may further includespacers SPC.

The spacers SPC may be arranged in a boundary area between the firstpressure sensing area PSA1 and the third pressure sensing area PSA3 andanother boundary area between the second pressure sensing area PSA2 andthe third pressure sensing area PSA3.

The spacers SPC may support the first base SB1 (refer to FIG. 9) and thesecond base SB2 (refer to FIG. 9) to be spaced apart from each other.The spacers SPC may include a polymer resin.

Referring to FIGS. 13B and 13C, the pressure sensing elements PS-5 andPS-6 may further include spacers SPC1, SPC2, and SPC2-1.

First spacers SPC1 may be disposed in the boundary areas between thefirst pressure sensing area PSA1 and the third pressure sensing areaPSA3 and between the second pressure sensing area PSA2 and the thirdpressure sensing area PSA3.

Second spacers SPC2 and SPC2-1 may be disposed between the firsttransmitting lines TL1 and the first receiving lines RL1 and between thesecond transmitting lines TL2 and the second receiving lines RL2. InFIG. 13B, only one second spacer SPC2 is disposed in each of the firstpressure sensing area PSA1 and the second pressure sensing area PSA2. InFIG. 13C, two second spacers SPC2-1 are disposed in each of the firstpressure sensing area PSA1 and the second pressure sensing area PSA2.However, it is understood that any number of second spacers SPC2 andSPC2-1 may be disposed between adjacent first transmitting lines TL1 andthe first receiving lines RL1 and between the second transmitting linesTL2 and the second receiving lines RL2 without deviating from the scopeof the present disclosure.

Shapes, positions, and numbers of the spacers SPC, SPC1, SPC2, andSPC2-1 shown in FIGS. 13A to 13C may vary without deviating from thescope of the present disclosure.

FIG. 14A is a cross-sectional view showing a portion of a pressuresensing element PS-7 according to an exemplary embodiment of the presentdisclosure. FIG. 14B is a plan view showing a portion of the pressuresensing element PS-7 according to an exemplary embodiment of the presentdisclosure.

The pressure sensing element PS-7 according to the exemplary embodimentof the present disclosure may include a coating layer CTL formed of ahydrophobic material. In detail, the coating layer CTL may include atleast one of fluorine (F) and silicon (Si). The coating layer CTL may bedisposed on the transmitting electrode ETT and the receiving electrodeETR and may be disposed under the main pressure sensing layer PLM. Thecoating layer CTL may overlap at least portions of the transmittinglines TL and the receiving lines RL.

The coating layer CTL prevents portions of the transmitting electrodeETT and the receiving electrode ETR from making a contact with the mainpressure sensing layer PLM and lowers a surface energy of thetransmitting electrode ETT and the receiving electrode ETR. Accordingly,a gap between the first base SB1 and the second base SB2 may bemaintained even in high-temperature or high-humidity environments.Although two portions of the coating layer CTL are show in FIGS. 14A and14B, it is understood that any number of portions of the coating layerCTL may be used without deviating from the scope of the presentdisclosure. In addition, the shape of the coating layer CTL is notlimited to a disc, and the coating layer CTL may have various othershapes without deviating from the scope of the present disclosure.

Although the exemplary embodiments of the present disclosure have beendescribed, it is understood that the present disclosure should not belimited to these exemplary embodiments but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present disclosure as hereinafter claimed.Therefore, the disclosed subject matter should not be limited to anyparticular embodiment described herein, and the scope of the presentinventive concept shall be determined according to the attached claims.

What is claimed is:
 1. A pressure sensing element comprising: a firstbase; a first transmitting electrode disposed on the first base andcomprising a first transmitting terminal and a plurality of firsttransmitting lines electrically connected to the first transmittingterminal; a first receiving electrode disposed on the first base andcomprising a first receiving terminal and a plurality of first receivinglines alternately arranged with the plurality of first transmittinglines and electrically connected to the first receiving terminal; afirst main pressure sensing layer disposed on the first transmittingelectrode and the first receiving electrode and spaced apart from thefirst transmitting electrode and the first receiving electrode by afirst set distance; a first sub-pressure sensing layer disposed on thefirst transmitting electrode and the first receiving electrode andmaking contact with the first transmitting electrode and the firstreceiving electrode without overlapping the first main pressure sensinglayer when viewed in a plan view; and a second base disposed on thefirst main pressure sensing layer and the first sub-pressure sensinglayer, making contact with the first main pressure sensing layer, andspaced apart from the first sub-pressure sensing layer by a second setdistance.